High-Performance Multilayer PCBs: Empowering Complex Electronic Systems‌

‌Added technological advantages::

• adoptionUltra-thin lamination technologyThe thickness control accuracy between layers reaches ±0.05mm, realizing the total thickness of 12-layer boards ≤1.2mm, and the signal transmission delay is reduced by 40%.
• exclusivityimpedance matching algorithmThe line width/spacing is optimized by AI simulation to ensure that the crosstalk of high-speed signals (e.g. PCIe 5.0) is ≤ -70dB.