Intelligence and Functional Integration: Toward the Next Generation PCB Embedded Sensing and Self-Healing Capabilities On-board temperature and stress sensors monitor operating conditions in real time, combined with A [...]
Advanced Manufacturing Process: Realize High Precision and High Reliability Ultra-fine Processing Technology Laser drilling combined with blind embedded hole process, realizing 0.075mm micro-hole, 30 [...]
Innovative Material Applications: Pushing the Performance Limits Material Innovations for High Frequency and High Temperature Scenarios The use of PTFE (polytetrafluoroethylene) copper-clad laminates in the 30 GHz band [...]
Customized PCBs: Flexible services to meet individual needs Added technical advantages: Modular design platform: Supports rapid combination of functional units, [...]
Flexible PCBs: Innovative solutions for breaking through space constraints Added technical advantages: Dynamic bending structure: Polyimide substrate supports 0.1m [...]
High-performance Multilayer PCBs: Empowering Complex Electronic Systems New Technology Advantage: Ultra-thin lamination technology with ±0% thickness control between layers [...]
“The ”dual carbon" goal and global environmental regulations to promote the PCB industry to low-carbon manufacturing transformation: Green substrates: halogen-free substrate use ratio of more than 65%, lead-free solder, [...]
1, technology evolution: from HDI to IC carrier board structural leap PCB technology is experiencing from the traditional high-density interconnect (HDI) to the class carrier board (SLP) [...]
As AI server architectures evolve to higher densities and speeds, PCBs are no longer simple circuit connection platforms, but have become a key physical base for determining arithmetic performance [...].
