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AI arithmetic drive: PCB from “connectors” to “arithmetic carriers”.”

随着AI服务器架构向更高密度、更高速度演进,PCB已不再是简单的电路连接平台,而是成为决定算力性能的关键物理基础。

  • 层数与结构升级‌:主流AI服务器主板层数从24层提升至30层以上,英伟达Rubin Ultra平台甚至采用78层正交背板,实现全板级高速互联。
  • 价值量跃迁‌:单台AI服务器PCB价值量可达8,000–10,000,远超传统服务器的1,000–2,000;高端背板如Kyber平台M9级PCB,单价突破$20万。
  • 材料革新‌:M9级覆铜板(CCL)成为标配,其介电损耗(Df)≤0.0005,支持224Gbps PAM4信号传输,生益科技、圣泉集团已实现量产并获英伟达认证。

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