盛华源PCB板生成厂家

致力于解决高精密板、高难度板、特种板、中小订单交付慢和采购难的问题

项目 project

参数 parameter

层数 number of layers

2-32层

最大拼版尺寸 Maximum layout size

730mm*630mm

成品板厚范围 Finished board thickness range

0.3mm~4.0mm

机械钻孔孔径范围 Mechanical drilling aperture range

0.1mm~6.5mm

镭射钻孔孔径范围 Laser drilling aperture range

70um~150um

最大铜厚 Maximum copper thickness

50Z

最薄芯板厚度 Thinnest core board thickness

0.05mm

最小线宽(面铜22±3)  Minimum line width (surface copper 22 ± 3)

0.05mm/2mil

最小线距(面铜22±3) Minimum line spacing (surface copper 22 ± 3)

0.05mm/2mil

最小焊环 Minimum welding ring

3mil

最小外形公差 Minimum external tolerance

+0.075mm

 

项目

project

量产制程能力

Mass production process capability

极限制程能力

Extreme process capability

最大生产尺寸 Maximum production size

630*730mm

630*730mm

孔位精度公差 Hole position accuracy tolerance

+0.05mm

+0.025mm

机械孔径尺寸 Mechanical aperture size

00.15mm~06.5mm

00.1mm~06.5mm

镭射孔径尺寸 Laser aperture size

070um~0150um

070um~0150um

最小槽孔孔径尺寸 Minimum slot aperture size

00.50mm

00.45mm

PTH孔孔径公差 PTH hole diameter tolerance

+0.075mm

+0.05mm

NPTH孔孔径公差 NPTH hole diameter tolerance

+0.05mm

+0.05mm

项目

project

量产制程能力

Mass production process capability

极限制程能力

Extreme process capability

沉铜生产尺寸范围 Size range for copper deposition production

≤730mm

≤735mm

沉铜生产产品厚度范围 Thickness range of copper deposition production products

0.075mm~1.8mm

0.05mm~2.4mm

孔铜生产厚度范围 Mechanical aperture size

13um~25um

13um~40um

面铜厚度均匀性 Production thickness range of perforated copper

R≤0.004mm

R≤0.002mm

孔铜厚度均匀性 Uniformity of Copper Thickness in Holes

+0.005mm

+0.003mm

通孔深度能力 Through-hole depth capability

10:1

10:1

盲孔深度能力 Blind hole depth capability

0.81

1:1

项目

project

量产制程能力

Mass production process capability

极限制程能力

Extreme process capability

板厚范围 Maximum production size

0.3~6.0mm

0.3~6.0mm

曝光对位精度 Hole position accuracy tolerance

±0.015mm

±0.005mm

最小孔环 Mechanical aperture size

单边≥0.05mm

单边≥0.05mm

1/3 OZ底铜最小线宽/线距 Laser aperture size

0.05mm/0.05mm

0.045mm/0.045mm

1/2 OZ底铜最小线宽/线距 Minimum slot aperture size

0.05mm/0.05mm

0.05mm/0.05mm

OZ底铜最小线宽/线距 PTH hole diameter tolerance

0.075mm/0.075mm

0.075mm/0.075mm

1/3 OZ底铜蚀刻公差 NPTH hole diameter tolerance

+0.005mm

+0.005mm

1/2 OZ底铜蚀刻公差

+0.005mm

+0.005mm

1 OZ底铜蚀刻公差

+0.0075mm

+0.0075mm

金手指Total pitch公差

30mm以下:±0.05mm

30~60mm: ±0.075mm

30mm以下:±0.03mm

30~60mm: ±0.05mm

项目

project

量产制程能力

Mass production process capability

极限制程能力

Extreme process capability

印刷偏位公差Maximum production size

+0.125mm

+0.1mm

曝光偏位公差Hole position accuracy tolerance

+0.05mm

+0.025mm

最小油墨桥 Mechanical aperture size

>0.075mm

>0.06mm

油墨厚度范围 Laser aperture size

0.01mm~0.055mm

0.01mm~0.055mm

墨厚度公差 Minimum slot aperture size

+0.010mm

+0.005mm

项目

project

量产制程能力

Mass production process capability

极限制程能力

Extreme process capability

镍厚(电镍金) Maximum production size

1um~20um

1um~20um

金厚(电镍金) Hole position accuracy tolerance

0.05um~0.25um

0.05um~0.25um

镍厚(化镍金) Mechanical aperture size

1um~15um

1um~15um

金厚(化镍金) Laser aperture size

0.025um~0.075um

0.025um~0.075um

膜厚(OSP) Minimum slot aperture size

0.2um~0.5um

0.3um~0.4um

项目

project

量产制程能力

Mass production process capability

极限制程能力

Extreme process capability

偏位公差 Deviation tolerance

+0.075mm

+0.05mm

文字最小高度 Minimum height of text

>1.0mm

>0.8mm

文字最小线宽 Minimum line width of text

>0.10mm

>0.075mm

文字到外形最小距离 Minimum distance from text to appearance

>0.4mm

>0.3mm

文字到线路最小距离 Minimum distance from text to line

>0.4mm

>0.3mm

文字到开窗PAD最小距离 Minimum distance from text to window PAD

>0.4mm

>0.5mm

项目

project

量产制程能力

Mass production process capability

极限制程能力

Extreme process capability

外形公差 Appearance tolerance

+0.075mm

+0.05mm

线路到板边最小距离 Minimum distance from circuit to board edge

>0.15mm

>0.125mm

成型边到覆盖膜开窗 Forming edge to cover film window

+0.15mm

+0.10mm

半圆孔最小直径 Minimum diameter of semi-circular hole

>0.5mm

>0.4mm

单元与单元最小间距 Minimum distance between units

>1mm

>1mm